| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Model Number | OEM/ODM/EMS |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Layer | 1-40 Layer |
| Model Number | PCB-0261 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Copper Thickness | 1 - 4OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Copper Thickness | 2-6oz |
| Min. Line Width/Space | 3/3mil |
| Min. Solder Mask Bridge | 3mil |
| Min. Annular Ring | 3mil |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Model Number | PCBA-0606 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
