| Condition | Used |
|---|---|
| Type | 2 Layer PCBA (PCB Assembly) |
| According To Designed Files | Meet Customer Requirements |
| Certificates | UL, RoHS, SGS, ISO9001 ISO14000 |
| Base Material | FR-4 |
| Type | Electronic PCB Assembly |
|---|---|
| Origin | Guangdong, China |
| Service | PCB &PCBA Service |
| Base Material | FR-4/Aluinum/CEM1/CEM3 PCB |
| Other Service | Turnkey Assembly Service |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm-4.5mm |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Aluminum |
| Insulation Materials | Epoxy Resin |
| Layer | 1-40 Layer |
| Board Thickness | 0.2-8.0mm |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1oz |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
